FutureCom End of Project workshop
A workshop to present outputs from the European Metrology Programme for Innovation and Research (EMPIR) funded project “FutureCom – RF Measurements for future communications applications”.
The workshop will present science developed by this three-year research project which involved eight European national metrology institutes (NMIs), four academic research institutes, one designated institute (DI) and seven industrial partners.
Topics to be discussed in the workshop include:
– Measurement of active devices and circuits
– Signal integrity (SI) and power integrity (PI) of FPGA chips and PCBs
– Environmental Testing of Electronic Circuits
– Measurement methods for passive inter-modulation in communication systems
The workshop is free to attend and can be attended on-line.
July 17, 2024 9:30 BST
Workshop Agenda
| Title | Speaker | TIme |
|---|---|---|
| Overview of the FutureCom project | Dilbagh Singh, NPL, UK | 09:30 |
| Good practice guide for reliable PIM measurements of RF electrical signals used in communications systems | Ahmed Sayegh, PTB, Germany | 09:50 |
| PIM-standards testing under different environmental and power conditions | Martín García-Patrón, INTA, Spain | 10:10 |
| A Simplified Setup for Passive Intermodulation Measurement | Martin Hudlicka CMI, Czech Republic | 11:30 |
| Measurement of Passive Intermodulation using a vectorial PIM system under different measurement conditions | Ahmed Sayegh, PTB, Germany | 10:50 |
| Coffee/Tea Break | 11:05 | |
| Good practice guide on the characterisation of active devices and circuits operating under non-50 Ω loading conditions and for large-signal measurement systems up to 220 GHz | Marco Spirito, TU Delft, Netherlands | 11:25 |
| Harnessing the Power of Modulated Signals: Source and Load Pull Characterization of RF Devices combined with Multi-Physics Measurements: Electro-Optical Electric Field and Thermo-reflectance Thermal Imaging | Koen Buisman University of Surrey, UK | 11:45 |
| Signal Integrity and Power Integrity at chip and board levels | Djamel Allal, LNE, France | 12:05 |
| Evaluating Aging Uncertainty of Impedance Standard Substrate in On-wafer S-parameter Measurements | Devika Poduval, VSL, Netherlands | 12:25 |
| Lunch Break | 12:40 | |
| Some results of the PCB testing in harsh environments | Osman Sibonjic, IMBiH, Bosnia and Herzegovina | 14:00 |
| Temperature Humidity Bias Testing of a Wafer-Embedded Coplanar Waveguide Line up to 40 GHz | Lewis Manning, NPL, UK | 14:20 |
| FutureCom Impact | Gianfranco Miele, University of Cassino and Southern Lazio, Italy | 14:40 |
| Panel discussion | 15:00 | |
| Coffee/Tea Break | 15:15 | |
| NPL lab visit (optional) | 15:30 |
