D. Allal et al., “RF Measurements for Future Communication Applications: an Overview,” 2022 IEEE International Symposium on Measurements & Networking (M&N), Padua, Italy, 2022, pp. 1-6, doi: 10.1109/MN55117.2022.9887740.
Sayegh A., Gellersen F., Stein F., Kuhlmann K., “Evaluation and Comparison of PIM Measurement Uncertainty using Different Methods,” International Workshop on Multipactor, Corona and Passive Intermodulation (MULCOPIM 2022), doi:10.7795/810.20221118
F. Mubarak, C.D. Martino, R. Toskovic, G. Rietveld, and M. Spirito, “VNA-based power sensor calibration”,Conference on precision electromagnetic measurements (CPEM 2022), New Zealand.
Pham T.-D., Ngoc Phung G., Lahbacha K., Maffucci A., Miele G., Arz U. and Allal D., “On-wafer test structures for the evaluation of signal integrity and power integrity at chip level”, Conference on precision electromagnetic measurements (CPEM 2022), Wellington, New Zealand, 12-16 December 2022.
Allal D., Ouameur M., Kuhlmann K. and Stein F., “Traceable scattering parameter measurement in 4.3-10 coaxial line”, Conference on precision electromagnetic measurements (CPEM 2022), Wellington, New Zealand, 12-16 December 2022.
F. Mubarak, F. Munoz, G. Rietveld, and M. Spirito, “A Receiver-based RF Attenuation Measurement System,” Conference on precision electromagnetic measurements (CPEM 2022), Wellington, New Zealand, 12-16 December 2022.
G. N. Phung et al., “Recommendations for the Design of Differential Thin-Film Microstrip Lines,” 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, 2023, pp. 1-4, doi: 10.1109/SPI57109.2023.10145555.
K. Lahbacha et al., “Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines (TFMSLs),” 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, 2023, pp. 1-4, doi: 10.1109/SPI57109.2023.10145525.
U. Arz, G. N. Phung and A. Rumiantsev, “Traceable Lumped-Element Calibrations up to 110 GHz on Commercial Calibration Substrates,” 2023 100th ARFTG Microwave Measurement Conference (ARFTG), Las Vegas, NV, USA, 2023, pp. 1-4, doi: 10.1109/ARFTG56062.2023.10148870.
G. N. Phung, H. Koo, C. Cho, J. Kwon and U. Arz, “D-Band Characterization of a Commercial High-Resistivity Silicon Calibration Substrate,” 2023 101st ARFTG Microwave Measurement Conference (ARFTG), San Diego, CA, USA, 2023, pp. 01-04, doi: 10.1109/ARFTG57476.2023.10279693.
E. Shokrolahzade, F. Sebastiano, F. Mubarak, M. Babaie and M. Spirito, “Impedance Standard Substrate Characterization and EM model definition for Cryogenic and Quantum-Computing Applications,” 2023 IEEE/MTT-S International Microwave Symposium – IMS 2023, San Diego, CA, USA, 2023, pp. 557-560, doi: 10.1109/IMS37964.2023.10188097.
A. G. Chiariello, G. Di Capua, A. Maffucci and N. Femia, “Models and Methods for the Analysis of PCB Crosstalk in Switch-Mode Power Supplies,” 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI), Lisbon, Portugal, 2024, pp. 1-4, doi: 10.1109/SPI60975.2024.10539215.
M. Hudlička and A. Sayegh, “A Simplified Setup for Passive Intermodulation Measurement,” 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Glasgow, United Kingdom, 2024, pp. 1-5, doi: 10.1109/I2MTC60896.2024.10560706.
