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Sayegh A., Gellersen F., Stein F., Kuhlmann K., “Evaluation and Comparison of PIM Measurement Uncertainty using Different Methods,” International Workshop on Multipactor, Corona and Passive Intermodulation (MULCOPIM 2022), doi:10.7795/810.20221118
F. Mubarak, C.D. Martino, R. Toskovic, G. Rietveld, and M. Spirito, “VNA-based power sensor calibration”,Conference on precision electromagnetic measurements (CPEM 2022), New Zealand.
Pham T.-D., Ngoc Phung G., Lahbacha K., Maffucci A., Miele G., Arz U. and Allal D., “On-wafer test structures for the evaluation of signal integrity and power integrity at chip level”, Conference on precision electromagnetic measurements (CPEM 2022), Wellington, New Zealand, 12-16 December 2022.
Allal D., Ouameur M., Kuhlmann K. and Stein F., “Traceable scattering parameter measurement in 4.3-10 coaxial line”, Conference on precision electromagnetic measurements (CPEM 2022), Wellington, New Zealand, 12-16 December 2022.
F. Mubarak, F. Munoz, G. Rietveld, and M. Spirito, “A Receiver-based RF Attenuation Measurement System,” Conference on precision electromagnetic measurements (CPEM 2022), Wellington, New Zealand, 12-16 December 2022.
G. N. Phung et al., “Recommendations for the Design of Differential Thin-Film Microstrip Lines,” 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI), Aveiro, Portugal, 2023, pp. 1-4, doi: 10.1109/SPI57109.2023.10145555.
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U. Arz, G. N. Phung and A. Rumiantsev, “Traceable Lumped-Element Calibrations up to 110 GHz on Commercial Calibration Substrates,” 2023 100th ARFTG Microwave Measurement Conference (ARFTG), Las Vegas, NV, USA, 2023, pp. 1-4, doi: 10.1109/ARFTG56062.2023.10148870.
G. N. Phung, H. Koo, C. Cho, J. Kwon and U. Arz, “D-Band Characterization of a Commercial High-Resistivity Silicon Calibration Substrate,” 2023 101st ARFTG Microwave Measurement Conference (ARFTG), San Diego, CA, USA, 2023, pp. 01-04, doi: 10.1109/ARFTG57476.2023.10279693.
E. Shokrolahzade, F. Sebastiano, F. Mubarak, M. Babaie and M. Spirito, “Impedance Standard Substrate Characterization and EM model definition for Cryogenic and Quantum-Computing Applications,” 2023 IEEE/MTT-S International Microwave Symposium – IMS 2023, San Diego, CA, USA, 2023, pp. 557-560, doi: 10.1109/IMS37964.2023.10188097.
A. G. Chiariello, G. Di Capua, A. Maffucci and N. Femia, “Models and Methods for the Analysis of PCB Crosstalk in Switch-Mode Power Supplies,” 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI), Lisbon, Portugal, 2024, pp. 1-4, doi: 10.1109/SPI60975.2024.10539215.
M. Hudlička and A. Sayegh, “A Simplified Setup for Passive Intermodulation Measurement,” 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Glasgow, United Kingdom, 2024, pp. 1-5, doi: 10.1109/I2MTC60896.2024.10560706.
D. Singh, M. Salter and N. Ridler, “Characterisation of Power Transistors for Wireless Network Applications Using Passive and Active Load-Pull,” 2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy, 2024, pp. 1-5, doi: 10.1109/MN60932.2024.10615466.
K. Lahbacha et al., “Measurement-Based Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines,” 2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy, 2024, pp. 1-6, doi: 10.1109/MN60932.2024.10615657.
L. Manning et al., “S-Parameter Analysis of Age Testing Effects on FR4-Based Printed Circuit Boards up to 10 GHz,” 2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy, 2024, pp. 1-6, doi: 10.1109/MN60932.2024.10615784.
A. Sayegh, N. Meyne and T. Kleine-Ostmann, “Measurement of Passive Intermodulation with Uncertainty Budget using a Vectorial-PIM System,” 2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy, 2024, pp. 1-6, doi: 10.1109/MN60932.2024.10615764.
D. Allal, A. Sayegh and F. Rausche, “S-Parameter Bilateral Comparison in 4.3-10 Coaxial Line,” 2024 Conference on Precision Electromagnetic Measurements (CPEM), Denver, CO, USA, 2024, pp. 1-2, doi: 10.1109/CPEM61406.2024.10645995.
E. Shokrolahzade, C. De Martino and M. Spirito, “Reduced Calibration Error Employing Parametrized EM models and DC Load Extraction,” 2023 100th ARFTG Microwave Measurement Conference (ARFTG), Las Vegas, NV, USA, 2023, pp. 1-4, doi: 10.1109/ARFTG56062.2023.10148882.
B. Louwes, M. J. Pelk, J. Bueno, E. Shokrolahzade, C. De Martino and M. Spirito, “A Fast High Sensitivity Power Transfer Device Approach for (sub)mm-wave applications,” 2024 103rd ARFTG Microwave Measurement Conference (ARFTG), Washington, DC, USA, 2024, pp. 1-3, doi: 10.1109/ARFTG61196.2024.10661083.
T. D. Pham et al., “Measurement and Analysis of On-Wafer Test Structures for Signal Integrity Assessment at Chip Level,” 2024 Conference on Precision Electromagnetic Measurements (CPEM), Denver, CO, USA, 2024, pp. 1-2, doi: 10.1109/CPEM61406.2024.10646002.
L. Manning, A. Robador and J. Skinner, “Temperature Humidity Bias Testing of a Wafer-Embedded Coplanar Waveguide Line up to 40 GHz,” 2024 103rd ARFTG Microwave Measurement Conference (ARFTG), Washington, DC, USA, 2024, pp. 1-4, doi: 10.1109/ARFTG61196.2024.10660883.
D. Poduval, F. A. Muñoz, G. Rietveld and F. A. Mubarak, “Evaluating Aging Uncertainty of Impedance Standard Substrate in On-wafer S-parameter Measurements,” 2024 Conference on Precision Electromagnetic Measurements (CPEM), Denver, CO, USA, 2024, pp. 1-2, doi: 10.1109/CPEM61406.2024.10646142.
